Silicon Analysts

• Get Accelerator Costs — Returns 18 AI accelerators (H100/H200/B100/B200/GB200/GB300/Rubin, MI300X/MI355X/MI455X, Gaudi 3, TPU v5p/v6e, Trainium 2/3, Maia 100, MTIA v2) with structured fields: chip, vendor, processNode, dieSizeMm2, memoryType, memoryCapacityGb, memoryBandwidthTbS, fp8TflopsSparse, bf16TflopsDense, packageType, estMfgCostUsd, estSellPriceUsd, chipGrossMarginPct, costBreakdown.{logicDie, hbm, packaging, testAssembly}, interconnect. USE THIS for: comparing manufacturing cost or sell price across vendors;
• Calculate Chip Cost — Pure-function chip cost estimator. Given die dimensions (mm), process node, and optional packaging/HBM parameters, returns: estimatedChipCost (USD), dieArea (mm²), grossDiesPerWafer, frontendYield (%), totalYield (%), and a costBreakdown {waferCostPerGoodDie, packagingAndTestCost, hbmCost, marginCost}. USE THIS for: hypothetical chip cost modeling, sensitivity analysis, fabless tapeout decisions. DO NOT USE for: published cost of an existing accelerator (use get_accelerator_costs); wafer prici
• Estimate Lead Time — Heuristic chip manufacturing LEAD TIME estimator (MANUFACTURING CYCLE TIME). Given total mask layers (or a processNode to default them), foundry utilization % (optional — defaults from live foundry-allocation data), and packagingType, returns min/max bands: fabDays, fabWeeks, packagingWeeks, totalWeeks, plus effectiveDpml (days per mask layer), the operating-curve weight, a resolved-inputs echo, assumptions, methodology, and public-source citations. USE THIS for: "how long to manufacture this c
• Get Hbm Market Data — Returns 10 HBM market sub-tables: accelerators, specs, marketShare, spotPrices (RETIRED 2026-07-28 — frozen), leadingIndicators, qualificationFeed, revenueForecast, supplierRevenue, validationChecks, bitDemand. Optional `table` parameter narrows to a single sub-table; omitting returns all 10. USE THIS for: HBM3/3e/4 generation specs, SK Hynix/Samsung/Micron market share, derived HBM bit demand by SKU class and customer type (bitDemand, EB ranges, monthly). spotPrices is a RETIRED series: no pu
• Get Market Pulse — Returns curated supply-chain headlines with trend direction (up/down/neutral), source attribution, and impact analysis. Categories: logic, memory, packaging, connectivity, power, geopolitics. Defaults to all categories, all trends, no limit. USE THIS for: "what's happening in HBM this quarter?", "any geopolitical moves affecting TSMC?", recent supply/demand inflections. DO NOT USE for: structured pricing data (use get_wafer_pricing, get_hbm_market_data); published cost of a specific chip (use
• Get Wafer Pricing — Returns 300mm wafer price ranges (min/avg/max USD), defect density, NRE/mask-set cost, and node maturity for: tsmc-n3, tsmc-n5, tsmc-n7, tsmc-n16, tsmc-28, samsung-3nm, samsung-5nm, samsung-7nm, samsung-14nm, intel-7, intel-16, gf-12lp, gf-fdx, umc-22-28, umc-40, smic-28. Optional `node` filter narrows to one. ALWAYS read `citation` before using a price in a cost model: it names the corroborating sources and carries the caveat that decides whether the number is usable. Some sellers report a foun
• Get Packaging Costs — Returns two sub-arrays: `packaging` (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and `hbmSpecs` (HBM2 through HBM4 cost per stack + bandwidth/capacity). Optional `type` filter narrows packaging array to one technology. USE THIS for: packaging cost lookup, comparing CoWoS variants, getting HBM stack pricing for cost modeling. DO NOT USE for: HBM market dynamics (use get_hbm_market_data); per-chip packaging cost in a shipping accelerator
• Get Hbm Qualification — Sourced HBM qualification tracker: which memory vendor (SK Hynix, Samsung, Micron) passed which AI-accelerator customer's qualification (NVIDIA Vera Rubin/GB300/B300/H200, AMD MI350/MI325X, Broadcom), by generation (HBM3/HBM3E/HBM4) and stack height. Returns `matrix` (current status per vendor×customer×generation, each row dated + source URL + confidence) and `timelines` (per-relationship status-change history back to 2022, e.g. sampling → in_qualification → qualified → volume_shipping). Refresh
• Get Foundry Allocation — Foundry & advanced-packaging ALLOCATION — the current-state snapshot per node/tech (TSMC/Samsung/Intel/... × N2/N3/CoWoS-L/SoIC/...) plus optional time-series HISTORY. Current fields: allocation_status (fully_booked → available), lead_time_weeks_min/max + trend, utilization, price_trend, geo_risk, customers, capacity_current/target, customer_shares, allocation_note. With include_history=true, returns the tracked series from capacity_signals: lead_time / booking-window, pct_locked (%-capacity-loc
• Get Foundry Economics — Foundry IR ECONOMICS — per-foundry, per-process-node, per-fiscal-quarter wafer ASP (min/max/blended, USD per 300mm-equivalent wafer, $250-grained) and fab UTILIZATION (%), derived exclusively from PUBLIC IR materials (earnings releases/transcripts/decks, trade press) via a documented scaling calculation (rev-mix-v1): reported revenue × reported node revenue-shares × reported wafer shipments, allocated on pinned analyst prior ratios. Covers tsmc | umc | intel | samsung | smic | gf. Every row carr
• Get Recent Changes — "What Changed" — recent MOVEMENTS in Silicon Analysts' public data over a 7d/30d window, derived from the daily snapshot ledger. Each moved metric returns direction (up/down), magnitude (pct_delta for value metrics, pp_delta for percentage metrics), old/new values, the two snapshot dates compared (as_of, prior_as_of), window_days_actual (the REAL lookback — the ledger is young, so a 30d window clamps to available history), and per-record provenance. Domains: wafer_pricing, chip_cost, margin_benc
• Get Market Dataset — Curated market-data TIME SERIES with per-point sourcing — the datasets behind siliconanalysts.com/market-data. Includes: hbm-pricing (HBM contract + blended $/GB by generation, HBM2→HBM4, anchors 2017→2026 — series_keys like 'hbm3e-contract'; NOTE: no public HBM spot market exists — HBM sells via LTAs, and the dataset says so rather than fabricating a spot curve), component-lead-times (CoWoS-S/CoWoS-L/HBM3E/TSMC-N3 lead times in weeks back to 2022), wafer-price-tsmc (wafer price by node back to
• Get Market Intelligence — Market Intelligence — the freshest SOURCED semiconductor market briefs, generated daily from a Tavily + Claude scan of primary press, earnings, and trade outlets. Each brief returns title, severity (Critical/High/Medium/Low), confidence_score (0-100), quantitative_impact (e.g. "Est. BOM increase: +$500"), an executive summary, a short analysis, a category (Logic/Memory/Packaging/Connectivity/Power/Geopolitics), and a curated sources[] list — plus per-record provenance. UNIQUELY: each brief also
• Get Market Advantage — Market Advantage — human-vetted TIME-ADVANTAGE evidence: dated, immutable proof that Silicon Analysts recorded a semiconductor supply-chain event BEFORE the first English-language coverage of it. For each win: our first-seen timestamp (immutable), the cited source's own publication time, the first English coverage's timestamp + its public URL/publisher, and the lead in hours (lead_time_hours_vs_detection). Only wins a human has CONFIRMED for citation are returned; nothing unvetted is ever expose
• Get Benchmark History — Historical Benchmarks — the bitemporal benchmark-observations ledger behind the Chip Cost Calculator: wafer cost by node/foundry (deflationary curves), defect-density (D0) learning curves per node, advanced-packaging costs incl. the broken-out CoWoS interposer entity, test cost, backend yield, and HBM $/GB. Each observation carries as_of (the date the reading reflects — curated backfill from dated public archives extends history), detected_at (capture time), and full sourcing metadata (source_ty
• Get Fab Capacity — Fab Capacity — per-fab, per-tech-node-class capacity from the fabs + fab_capacity_snapshots time-series (65 fabs: TSMC, Samsung, Intel, SMIC, GlobalFoundries, and more; Frontend in kwspm, Backend advanced-packaging in k units/month). Default mode returns the LATEST state per (fab, node class) at/before as_of, joined with fab metadata (name, foundry, country, status) and availability_status (fully_booked → available). series=true returns the full dated series — node conversions appear as capacity
• Get Forecasts — Forecast Vintages — third-party forecasts (research firms like TrendForce/WSTS/SEMI, and company capex/bit-growth guidance) archived with their ORIGINAL publication date. Query the REVISION HISTORY, not just the latest number: "what did TrendForce say about 2026 HBM bit growth in January vs July?". Each row: originator, originator_type, metric, target_period (e.g. CY2026, 2027H1), value (num or low/high), unit, as_of (publication date), a source URL, and a verbatim quote. This is the vintage arc
• Get Track Record — Forecast Track Record — Silicon Analysts' OWN projections, frozen monthly into write-once vintages and graded against outcomes. Every row: model, scenario (bear/base/bull), series, target period, the predicted mid + low–high band frozen at vintage time, and once the period matures, the realized value with a correct/partial/incorrect resolution and error %. Vintages cannot be backfilled or edited — a changed projection that was never frozen is gone, which is what makes this a track record. USE T
• Get Wfe Signals — WFE Order-Book — wafer-fab-equipment maker disclosures (ASML, Applied Materials, Lam Research, KLA, Tokyo Electron) from quarterly IR: bookings, backlog, segment revenue, and guidance, in the STATED currency (EUR for ASML, JPY for TEL, USD for the rest — never converted). The 12–24-month leading indicator for fab capacity. Each row: company, fiscal_period, metric, value(s), unit, as_of (release date), source URL, verbatim quote. USE THIS for: "is the equipment order-book turning up or down?", A
• Get Fab Events — Fab Milestones — the dated construction & ramp event log: announcement → groundbreaking → equipment move-in → risk production → HVM, plus expansions and SCHEDULE SLIPS recorded as their own events (a delay never overwrites the original plan). Back to 2020. Each row: foundry, fab_name, event_type, event_date, announced_date, a summary, source URL, verbatim quote, and is_projection for forward-dated milestones. USE THIS for: "which fabs hit a milestone recently?", tracking TSMC Arizona / Samsung
• Get Policy Events — Trade-Policy Timeline — the dated log of semiconductor trade-policy actions (export controls, entity listings, license policies, tariffs, subsidies, retaliation) anchored to GOVERNMENT PRIMARY documents (Federal Register / BIS, USTR, MOFCOM, METI, EU, Netherlands…), back to the Oct 2022 BIS advanced-computing rule. Each row: jurisdiction, agency, event_type, title, published/effective dates, affected_entities, node_threshold, a document reference (e.g. Federal Register cite), source URL, verbati

Schemas and invoke metadata: Directory API